| Packaging | ||||
|---|---|---|---|---|
| Title | Doc Version | Release Date | File Size | Document Part Number |
| Data Sheets | ||||
Altera Device Package Information Data Sheet 
| 15.4 | Dec 2008 | 3 MB | DS-PKG-15.4 |
| Application Notes | ||||
| AN 353: Reflow Soldering Guidelines for Lead-Free Packages | 1.0 | Jul 2004 | 89 KB | AN-353-1.0 |
| AN 114: Designing with High-Density BGA Packages for Altera Devices | 5.1 | Dec 2007 | 574 KB | AN-114-5.1 |
| AN 113: Plastic Package Reliability & Testing | 1.0 | Jun 1999 | 180 KB | A-AN-133-01 |
| AN 90: SameFrame Pin-Out Design for FineLine BGA Packages | 1.01 | Sep 2000 | 277 KB | A-AN-090-01.01 |
| AN 81: Reflow Soldering Guidelines for Surface-Mount Devices | 4.0 | Jun 2002 | 147 KB | AN-081-04 |
| AN 80: Selecting Sockets for Altera Devices | 3.0 | Jan 1999 | 152 KB | A-AN-080-03 |
| AN 71: Guidelines for Handling J-Lead & QFP Devices | 4.0 | Jan 1999 | 303 KB | A-AN-071-04 |
| White Papers | ||||
| Challenges in Manufacturing Reliable Lead Free Components | 1.0 | Feb 2004 | 388 KB | WP-CHMFGRELLDFR-1.0 |
