Altera Home Page
Literature Licensing
Buy On-Line Download

  Home   |   Products   |   Support   |   End Markets   |   Technology Center   |   Education & Events   |   Corporate   |   Buy On-Line  
  Devices   |   Design Software   |   Intellectual Property   |   Design Services   |   Dev. Kits/Cables   |   Literature  

 High-End FPGAs
      About Stratix Series
   Stratix IV (E and GX)
   Stratix III (L and E)
   Stratix II (and GX)
   Stratix (and GX)
  
 Midrange FPGAs
   Arria (GX)
  
 Low-Cost FPGAs
   Cyclone III
       Overview
               Architecture
               Power
          End Markets & Applications
          Design Resources
          Literature
          Getting Started
   Cyclone II
   Cyclone
  
 CPLDs
   MAX II (and G, Z)
   MAX 3000A
  
 ASICs
      About HardCopy Series
   HardCopy IV (E and GX)
   HardCopy III
   HardCopy II
   HardCopy Stratix
  
 Device-Specific Offerings
   RoHS Compliant
      Extended Temperature
      Industrial Temperature
      Military Temperature
      Automotive Temperature
  
 Configuration Devices
   Enhanced Configuration
   Serial Configuration
  
 Mature Products
      Product Listing
  

Cyclone III FPGA Family Overview

The low-cost Cyclone® III FPGA family is the third generation in the Altera® Cyclone series. With its unprecedented combination of low power, high functionality, and low cost, the Cyclone III FPGA family broadens the number of high-volume, cost-sensitive applications that can benefit from FPGAs.

Built on Taiwan Semiconductor Manufacturing Company's (TSMC's) 65-nm low-power process technology, Cyclone III devices have additional silicon and software optimizations to offer the lowest power consumption of any 65-nm FPGA and an optimal set of features to drive high-bandwidth parallel processing along with many other cost-sensitive and power-sensitive applications.

The Cyclone III family is composed of eight devices ranging from 5K to 120K logic elements (LEs) and up to 535 user I/O pins. As shown in Table 1, Cyclone III devices offer up to 4-Mbit of embedded memory, 288 embedded 18-bit x 18-bit multipliers, dedicated external memory interface circuitry, phase-locked loops (PLLs), and high-speed differential I/O capabilities.

The Cyclone III FPGA family offers a broad range of devices and package options to support a wide variety of cost-sensitive high-volume applications. Cyclone III devices are available in up to three temperature grades to support varying operating environments with junction temperature support from -40°C to 125°C. Please refer to the Cyclone III Device Handbook for more information.

Table 1. Cyclone III FPGA Overview
Device EP3C5 EP3C10 EP3C16 EP3C25 EP3C40 EP3C55 EP3C80 EP3C120
Logic Elements 5,136 10,320 15,408 24,624 39,600 55,856 81,264 119,088
M9K Embedded Memory Blocks (1) 46 46 56 66 126 260 305 432
Total RAM (Kbits) 414 414 504 594 1,134 2,340 2,745 3,888
Embedded
18-bit x 18-bit Multipliers
23 23 56 66 126 156 244 288
PLLs 2 2 4 4 4 4 4 4
Maximum User I/O Pins 182 182 346 215 535 377 429 531
Differential Channels 70 70 140 83 227 163 181 233
Availability (2) Buy Now Buy Now Buy Now Buy Now Buy Now Buy Now Buy Now Buy
Now

Note:

  1. M9K memory blocks offer 9,216 bits per block (including parity bits).
  2. Learn more about industrialextended industrial, and automotive temperature device options.

As shown in Table 2, the Cyclone III device family is available in nine different package options with support for low-cost and small form factor packages.

Table 2. Cyclone III Device Packages and Maximum User I/Os (1)
Device/Package
(mm x mm)
144-Pin
EQFP
(22 x 22)
(2)
164-Pin
MBGA
(8 x 8)
(7)
240-Pin
PQFP
(32 x 32)
(3)
256-Pin FBGA
(17 x 17)
(4)
256-Pin UBGA
(14 x 14)
(5)
324-Pin FBGA
(19 x 19)
484-Pin FBGA
(23 x 23)
484-Pin UBGA
(19 x 19)
780-Pin FBGA
(29 x 29)
EP3C5

94

106 - 182 182 - - - -
EP3C10

94

106 - 182 182 - - - -
EP3C16

84

92 160 168 168 - 346 346 -
EP3C25

82

- 148 156 156 215 - - -
EP3C40

-

- 128 - - 195 331 331 535 (6)
EP3C55

-

- - - - - 327 327 377
EP3C80

-

- - - - 295 295 429
EP3C120

-

- - - - - 283 - 531

Notes:

  1. Color denotes vertical migration                 
  2. EQFP = Enhanced Thin Quad Flat Pack                 
  3. PQFP = Plastic Quad Flat Pack                 
  4. FBGA = FineLine Ball-Grid Array (1.0-mm pitch)
  5. UBGA = Ultra FineLine Ball-Grid Array (0.8-mm pitch)
  6. EP3C40 in the F780 package supports restricted vertical migration
  7. MBGA = Micro Ball-Grid Array (0.5-mm pitch)

Table 3 shows the speed grades for Cyclone III devices.

Table 3. Cyclone III Family Speed Grades (1), (2)
Device 144-Pin EQFP 164-Pin MBGA 240-Pin PQFP 256-Pin FBGA 256-Pin UBGA 324-Pin FBGA 484-Pin FBGA 484-Pin UBGA 780-Pin FBGA
EP3C5 -7, -8 -7, -8 - -6, -7,
-8
-6, -7,
-8
- - - -
EP3C10 -7, -8 -7, -8 - -6, -7,
-8
-6, -7,
-8
- - - -
EP3C16 -7, -8 -7, -8 -8 -6, -7,
-8
-6, -7,
-8
- -6, -7,
-8
-6, -7,
-8
-
EP3C25 -7, -8 - -8 -6, -7,
-8
-6, -7,
-8
-6, -7,
-8
- - -
EP3C40 - - -8 - - -6, -7,
-8
-6, -7,
-8
-6, -7,
-8
-6, -7,
-8
EP3C55 - - - - - - -6, -7,
-8
-6, -7,
-8
-6, -7,
-8
EP3C80 - - - - - - -6, -7,
-8
-6, -7,
-8
-6, -7,
-8
EP3C120 - - - - - - -7, -8 - -7, -8

Notes:

  1. Cyclone III devices are available in up to three speed grades, with -6 being the fastest.
  2. For Cyclone III devices, Altera's guideline for core fMAX change between each speed grade is on average 15 to 20 percent. 

Related Links

 

Next Steps

Buy Now

Support

Documentation

  Please Give Us Feedback