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Altera and TSMC: Working together for increased productivity

Altera and TSMC have worked together in FPGA technology since 1993. From design through tape out, together we’re constantly refining the manufacturing process, resulting in chips that are rolled out successfully from node to node.

What’s more, we’re also redefining the foundry model. Traditionally, foundries and their IC customers worked in their respective areas—manufacturing process development and IC design—somewhat autonomously. This resulted in longer time to market and higher costs. Through a new integrated model, Altera and TSMC engineers collaborate on both manufacturing process development and IC design to achieve better and faster results that are, in turn, passed on to you.

TSMC often qualifies its manufacturing process with Altera test chips. Test chips address design issues upfront while validating circuit design and process characteristics. For Altera, a faster manufacturing ramp means a faster production cycle for our devices.

TSMC Model

More for less

According to Moore’s Law, the more transistors we can fit onto a chip, the greater the performance. Following successful 45-nm production in 2007, TSMC is the first and only foundry to deliver a 40-nm process technology. The goal is to provide advanced technology options that allow customers to differentiate products in today’s competitive electronic market places.

Devices fabricated on 40-nm process technologies are robust, reliable, and ready for integration into an array of high-end applications. And, you’ll find that they meet your power, performance, and cost expectations.

TSMC’s 40-nm process was developed to deliver a variety of advantages, including:

  • A 2.35 times density improvement compared to devices built on 65-nm process technology
  • A 15 percent improvement in active power consumption compared to 45 nm
  • The foundry segment’s smallest SRAM cell size at 0.242µm2
  • Multiple Vt core devices and 1.2V, 1.8V, and 2.5V I/O options to meet different product requirements

Improved Time to Market

When you’re building advanced systems, fast time to market and reliable time to volume are vital. Together, the Altera® and TSMC partnership forges an incredibly strong link in your supply chain. Our relationship ensures predictable new product timing, functionality, and availability to support your go-to-market needs.

Working in Volume

TSMC’s two state-of-the-art 300-mm (12”) GigaFabs give Altera the power to quickly and effectively meet market demand and respond to your needs (see Figure 2).

Figure 1. Inside TSMC’s Fab 12 GigaFab That Produces 300-mm Wafers

Figure 1. Inside TSMC's Fab 12 GigaFab that produces 300-mm wafers.

Winning Through Close Collaboration

To fully leverage today’s 40-nm advanced process, you need a foundry with the proven experience to make you a winner. TSMC’s deep, broad collaboration with Altera assures your success from start to finish.

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